| 摘要 |
PURPOSE: To provide an infrared detecting device which has an electrical wiring extended on a sidewall of step structures, as molded body parts made of materials sensitive to infrared rays. CONSTITUTION: A compact electrical wiring 4 is formed on a sidewall 1 of an infrared-detecting element having step structures 1 to 3, and a conductive layer 40 is bonded onto the step structures. The conductive layer 40 can be removed at least from a bottom 3 of the step structures by a directional etching process, such as an ion milling, but it does backing on the sidewall 1 as the wiring 4. Thereby there can be formed a compact and dense array of the wirings 4 and 44, including a plurality of wavelength arrays in a body stacked on a circuit substrate 30. |
