发明名称 SEMICONDUCTOR INSPECTING METHOD
摘要 <p>PURPOSE:To make it possible to obtain electric continuity with a measuring apparatus readily and positively even for an IC package, whose body size is reduced by miniaturization, and to perform the inspection of electric characteristics. CONSTITUTION:An IC package 2 is fixed with a vacuum chuck 5. The deviation between a lead 3 of the IC package 2 and a contact pin 4 is adjusted with an upper camera 1 by image processing, and the correct position is set. The electric continuity with a measuring apparatus is obtained by providing the contact between the lead 3 of the IC package 2 and the contact pin 4.</p>
申请公布号 JPH0618612(A) 申请公布日期 1994.01.28
申请号 JP19920175356 申请日期 1992.07.02
申请人 SEIKO EPSON CORP 发明人 HONDA SHINJI
分类号 G01R31/26;H01L21/66;H01L21/68;(IPC1-7):G01R31/26 主分类号 G01R31/26
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