| 摘要 |
PURPOSE:To provide a thin and highly reliable mounting structure for semiconductor element at low cost that can efficiently dissipate heat generating from the semiconductor element. CONSTITUTION:The structure is provided with a thermal conducting member 18 in a space between a semiconductor package 12 and a printed wiring board 17 in order to transmit heat generating from a semiconductor element to the printed wiring board. Since the printed wiring board entirely consisting of copper wiring is highly thermal-conductive, it can efficiently dissipate the heat generating from the semiconductor element. Furthermore, a thin and light-weight mounting structure can be provided at low cost because a heat radiation fin became unnecessary compared with the prior art one. |
