CHIP BONDING METHOD OF SEMICONDUCTOR

摘要

The method is for bonding chips on die pads of the IC manufacturing apparatus. The chip bonding method distributes the pressure generated on the lower face of the die pad so that it can prevents gaps or cracks from generating between the die pad and a package. The chip bonding method comprises forming adhesive agent (13) in a dot type and adhering the chip (12) to the die pad (11); pressing the chip (12) toward the die pad (11) and making a buffer space (18) between the adhesive agent (13); and bonding the chip (12) and a lead (14) with golden wire (15) and cutting/bending the lead (14).