| 摘要 |
<p>PURPOSE:To connect electrodes through a collective reflow method with low melting point metal brazing material such as Pb-Sn solder when a parallel plate capacitor is mounted on a board. CONSTITUTION:A metal plate 3 which is electrically conductive and larger in area than an electrode 2 of a parallel plate capacitor 1 is connected to the electrode 2. On the other hand, an opening 5 is provided in a board 4, a grounding potential electrode 6 is provided to the base of the opening 5, a power supply potential electrode 7 is provided around the opening 5, and the parallel plate type capacitor 1 is mounted in the opening 5 through the intermediary of solder 3.</p> |
