The wire bonding method is for preventing an actuation error of a wire bonder caused in the case that there is a distance between a lead and a lead rod. The wire bonding method comprises bonding a chip and one end of the correspondent lead; bonding a spot of a scheduled lead surface while transferring the bonder from the bonded lead to other chip surface at least one time, and bonding one end of the scheduled lead and the correspondent chip surface; and repeating the above steps.
