METHOD OF DETECTING BONDING PATTERN OF SEMICONDUCTOR

摘要

PURPOSE:To perform positioning with high accuracy by arranging a part having bumps and a part having leads vertically, irradiating X-rays on two parts from one side, and detecting the bump and lead patterns photographed with a X-ray camera on the other side. CONSTITUTION:One part is an Si substrate having bumps of Al. Another part is a substrate 2 of polyimide or the like having leads 1 of Cu and Al. X-rays transmit through both substrates but not through the bumps and the leads. The parts 8 and 2 are vertically arranged to be irradiated from one side by X-rays 15 and photographed on the other side by an Y-ray camera 16, and then the positional deviation of the bumps 7 and leads 1 is corrected and jointed each other. According to this constitution, the accuracy of a connecting position is improved and since the pattern can be detected after connection the reliability can be improved.