| 摘要 |
PURPOSE: To easily obtain a multi-layered, microelectronic circuit module relatively inexpensively by laminating and thermo-compression bonding a plurality of thermoplastic polymer sheets, having via conductor patterns which have desired shape and dimensions as an electrically connecting means. CONSTITUTION: A plurality of, e.g. three thermoplastic polymer sheets 10 are prepared, a via conductor 12 having desired shape and dimensions as electrically connecting means are provided within each of the sheets 10 on its upper and lower faces, and a conductive pattern 16 is provided on the upper and lower faces of each sheet 10 at a predetermined location. Then the individual sheets 10 are stacked and applied with heat and compression simultaneously, and bonded to each other due to a mutual cohesion and adhesion, based on the thermoplastic characteristics of coating of polyimide or liquid crystal polymer(LCP) or mixture thereof. Thereby the via conductors 12 of the adjacent sheets 10 can be connected electrically to thereby form a module having a predetermined conductive path established therein. |
