发明名称 |
MOUNTING OF ELECTRIC PARTS ON CIRCUIT BOARD |
摘要 |
PURPOSE:To obtain an electric parts mounting the method not requiring printing of solder and a process of applying heat on the whole of a product. CONSTITUTION:Anisotropic conductive materials 3a, 3b are pressure-fixed by thermal pressure fixing (pressure, heating) an upper insulation sheet 2 and a lower insulation substrate 1 from up and down for being conducted in the thickness direction in order not only to electrically connect a terminal 4a of an electric part 4 to an upper conductive wiring pattern 2a and the terminal 4a of the electric part 4 to a lower conductive wiring pattern 1a but also to conduction-connect the upper conductive wiring pattern 2a to the lower conductive pattern 1a without through the terminal 4a of the electric part 4. |
申请公布号 |
JPH0621627(A) |
申请公布日期 |
1994.01.28 |
申请号 |
JP19920023515 |
申请日期 |
1992.02.10 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
MITO KOICHI;TANABE KOJI;NISHIOKA NAOHIRO;OTOMO KENJI;OKAZAKI YOSHITO |
分类号 |
B23K1/00;B23K20/02;H05K1/18;H05K3/28;H05K3/30;H05K3/32;H05K13/04;(IPC1-7):H05K3/32 |
主分类号 |
B23K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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