发明名称 MOUNTING OF ELECTRIC PARTS ON CIRCUIT BOARD
摘要 PURPOSE:To obtain an electric parts mounting the method not requiring printing of solder and a process of applying heat on the whole of a product. CONSTITUTION:Anisotropic conductive materials 3a, 3b are pressure-fixed by thermal pressure fixing (pressure, heating) an upper insulation sheet 2 and a lower insulation substrate 1 from up and down for being conducted in the thickness direction in order not only to electrically connect a terminal 4a of an electric part 4 to an upper conductive wiring pattern 2a and the terminal 4a of the electric part 4 to a lower conductive wiring pattern 1a but also to conduction-connect the upper conductive wiring pattern 2a to the lower conductive pattern 1a without through the terminal 4a of the electric part 4.
申请公布号 JPH0621627(A) 申请公布日期 1994.01.28
申请号 JP19920023515 申请日期 1992.02.10
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 MITO KOICHI;TANABE KOJI;NISHIOKA NAOHIRO;OTOMO KENJI;OKAZAKI YOSHITO
分类号 B23K1/00;B23K20/02;H05K1/18;H05K3/28;H05K3/30;H05K3/32;H05K13/04;(IPC1-7):H05K3/32 主分类号 B23K1/00
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