| 摘要 |
PURPOSE:To improve the location detecting easiness of a non-perforated through hole inside a pad at the repairing time of a multilayer printed wiring board in the multilayer printed wiring board having a pad inside non-perforated through hole. CONSTITUTION:In a multilayer printed wiring board forming a pad inside non- perforated through hole 3 in a pad 2a, two spots of nick parts 4a are provided on the adjacent edges of a pad 2a so as to intersect toward the center of the pad inside non-perforated through hole 3. Thereby, at the time of repairing a pattern to the pad inside non-perforated through hole 3, its location can be easily detected. |
