| 摘要 |
PURPOSE:To prevent the occurrence of package cracks at the time of surface mounting by bonding an IC chip, which is bonded on a die pad, and a lead frame, which is formed on a polyimide tape that is stuck to the outer surface of the die pad, and performing resin sealing only on the upper side of the die pad. CONSTITUTION:An IC chip 3 is bonded on a die pad 1 corresponding to the bottom area of a package body comprising metal by using a die bonding agent such as Ag paste. An Al electrode on the IC chip 3 and a lead frame 6 are bonded by using Au wires 7. In the manufacturing method of the lead frame at this time, a polyimide tape 4 is stuck at the outer surface part of the die pad 1, and the lead frame 6 is bonded by using a bonding agent 5. Thus, the separation of the rear surface of the lead frame and the resin, which induces the trouble generated when the entire mounting on the surface is heated, can be removed. |
