SEMICONDUCTOR DEVICE, COB SUBSTRATE, TAB SUBSTRATE, AND LEADFRAME

摘要

PURPOSE:To increase a packaging density, and to improve reliability while the size of a substrate is reduced by arranging a number of substantially rectangular inner leads at a predetermined inclined angle with respect to each side of a substrate body. CONSTITUTION:A number of outer leads 14 are arranged along a longer side 15a and the other longer side 15b of a substrate body 15 in an imbalanced manner. If these outer leads are arranged parallel to each other in a conventional way, interconnection patterns 13 will be arranged close to each other in the vicinity of the upper right and the lower left corners of a die pad 11. All of the rectangular inner leads 12 are arranged only at an inclined angle thetato the right on a COB 10, and hence a large spacing can be assured in the vicinity of the upper right and lower left corners of the die pad 11 where the patterns 13 are likely to be arranged close to each other. Hence, interconnection patterns that are adjacent to each other are arranged at predetermined intervals, thereby achieving high density. The width 'W' of the substrate body 15 can be reduced while the patterns 13 are arranged at intervals which are larger than the predetermined value.