| 摘要 |
The dummy wire bond pads 4A, 4B, 4C are formed between the wire bond pads 1A, 1B, and between the top, middle and lower parts of the chip. The wire bond pad 1C passing through the pad 4A eliminates the crossing contact of the wires and the pads 3A and 3B passing through the pads 4B and 4C prevent shorting of the wires due to the increase of the length.
|
