Verfahren und Vorrichtung zum Stapeln von Substraten, die durch Bonden miteinander zu verbinden sind

摘要

Proposed are a method and device for bonding multi-layer stacks of substrates over the whole substrate surface in only one operation with uniform heating, the featured substrates previously being aligned with high precision with respect to each other, in accordance with their features, in a work area remote from the heating device.