Kupferlegierung für elektronische Einrichtungen

摘要

A copper alloy for electronic devices is described, which contains 1.0% by weight to 8% by weight of Ni, 0.1% by weight to 0.8% by weight of P, 0.06% by weight to 1% by weight of Si, the remainder being copper and unavoidable impurities. A wire or strip of such a copper alloy for an electronic device is produced by heating the wire or strip described to a temperature from 750@C to 950@C for a time longer than 1 minute before the finish-rolling, followed by quenching in water or oil and heating of the quenched wire or strip to a temperature from 350@C to 500@C for more than 10 minutes. Instead of quenching, slow cooling can also be carried out.