Polyimidsubstrat mit texturierter Oberfläche und Metallbeschichtung solch eines Substrates.
摘要
<p>The adhesion of metal to a polyimide substrate is enhanced by depositing onto at least one surface of the polyimide a thin film of metal such as copper and heating in air to cause the deposited metal to texturize that surface by producing asperities that are at least 0.05 mu m in average height and average breadth. In doing so, metal oxide clusters are formed at the textured surface. When the textured surface is metallized, the resulting composite resists delamination even at soldering temperatures.</p>
申请公布号
DE69005214(D1)
申请公布日期
1994.01.27
申请号
DE1990605214
申请日期
1990.06.19
申请人
MINNESOTA MINING AND MFG. CO., SAINT PAUL, MINN., US
发明人
SOMASIRI, NANYAKKARA L.D., C/O MINNESOTA MINING, ST. PAUL, MINNESOTA 55133-3427, US;SPECKHARD, THOMAS A, C/O MINNESOTA MINING, ST. PAUL, MINNESOTA 55133-3427, US