发明名称 Polyamide resin composition.
摘要 <p>There is disclosed a polyamide resin composition comprising (A) 100 parts by weight of a polyamide (a) composed mainly of a xylylenediamine component and an alpha , omega -straight chain aliphatic dibasic acid component, or a combination of the polyamide (a) and polyamide 66, (B) 1 to 15 parts by weight of polyamide 12, (C) 0.01 to 5 parts by weight (in terms of copper) of a copper compound, (D) 1 to 15 parts by weight of carbon black, and (E) an alkali metal halide of such an amount that the number of halogen atoms of the alkali metal halide is 0.3 to 4 per one copper atom of the above copper compound. Said poluamide resin composition has an excellent weather resistance, moldability, and mechanical properties, and can be injection-molded.</p>
申请公布号 EP0580387(A1) 申请公布日期 1994.01.26
申请号 EP19930305653 申请日期 1993.07.19
申请人 MITSUBISHI GAS CHEMICAL COMPANY, INC. 发明人 WATANABE, NORIYOSHI;MORISHIGE, KIYOSHI;INOUE, HAJIME
分类号 C08K3/00;C08K3/04;C08K3/10;C08K3/16;C08K3/22;C08K3/34;C08K5/56;C08K7/02;C08K13/04;C08L77/00;C08L77/06;(IPC1-7):C08L77/06 主分类号 C08K3/00
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