Testing and exercising individual, unsingulated dies on a wafer.

摘要

Signals (including probes) from an external system (360) are selectively connected to a plurality of unsingulated dies (102) on a semiconductor wafer (300) with a minimum number of connections and an electronic selection mechanism (350) resident on the wafer (300). The electronic selection mechanism (350) is connected to the individual dies (102) by conductive lines (310) on the wafer (300). The electronic selection mechanism (350) is capable of providing the external signals (or connecting the external probe) to a single die (102) or groups of the dies (102), and electronically "walking through" the entire plurality of unsingulated dies (102). Redundant conductive lines may be provided. Diodes and/or fuses may be provided in conjunction with the conductive lines (310), to protect against various faults which may occur in the conductive lines (310). Redundant electronic selection mechanisms may also be provided to ensure the ability to selectively provide signals to the unsingulated dies (102). <IMAGE>