Intra-module spare routing for high density electronic packages.

摘要

A method of fabricating a high density electronic package is disclosed. The package (10) includes a module (12) of laminated semiconductor chips (14), including spare chip(s) and a supporting substrate (18) with a fixed interconnect pattern (20). Chip connection pads are provided at a first pad level of the module; one or more pads corresponding to each chip in the module (12). The module is tested at the first pad level to identify defective chip(s). A spare routing pattern is applied to the module for electrically isolating defective chip(s) and effectively substituting spare chip(s) therefor such that a predetermined pattern of metal interconnect landings (30) on an access surface of the module remains unchanged, as does the supporting substrate.