Cooling of electronic components.

摘要

A rack (12) for supporting and cooling modules (32) containing electronic components is described. The rack has a plurality of slots formed therein for receiving said modules. The slots (10) are defined by interior surfaces of wall portions (14) to which each module is thermally coupled when same is positioned in the slot. Cooling fluid is distributed around the exterior surfaces of the wall portions forming the slots. Thus, heat is drawn away from the electronic components due to the thermal coupling between the module and the slot walls. Advantageously, the wall portion substantially enclose each module to provided maximum cooling capability. Furthermore, the walls of the module and/or the walls of the slot may be flexible, thereby allowing flexure thereof to enable physical contact between the module and the slot walls when the module is fitted in the slot, and no contact when it is desired to insert or remove the module from the slot. Compressible, thermally conducting shims for positioning between the modules and the slot walls are also disclosed. <IMAGE>