| 摘要 |
A method of supporting a wafer comprising the steps of: dividing a pressure space formed between the table plate and the wafer into a first pressure space and a second pressure space by means of a pressure setting wall, setting a supporting pressure of a compressed air supplied to the first pressure space, by a throttle function of a throttle passage formed between a pressure regulating wall and the wafer, and determining a further supporting pressure of the compressed air supplied from the first pressure space to the second pressure space through the throttle passage, by a throttle function of a throttle opening for connecting the second pressure space with the atmosphere. A wafer supporting apparatus for carrying out the method and a wafer mounter having the apparatus.
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