HALOGENATED POLYIMIDE COMPOSITION ENHANCED IN ADHESION AND PRODUCT PRODUCED BY USING IT

摘要

PURPOSE: To enhance the adhesion of a metal layer to a polyimide compsn. as a base layer by forming an imidated layer from a reaction product obtained by reacting a halogenated polyamide acid with a specific amt. of water and forming a metal layer on the surface of the imidated layer. CONSTITUTION: In relation to a halogenated polyamide surface showing the adhesion to the metal layer formed on the surface, an imidated layer obtained by reacting halogenated polyamide acid with about 0.1-14 wt.% of water and the metal layer formed on the surface of the imidated layer are provided. The metal layer consists of the first metal layer formed on the surface by electroless plating and the second metal layer formed on the first metal layer by electroplating or electroless plating. The first metal layer comprises nickel and the second metal layer pref. comprises copper.