发明名称 |
Low temperature sealing glass composition |
摘要 |
A low temperature sealing glass composition suitable for sealing integrated circuit alumina packages at temperatures below 400 degrees C. in a short time of about ten minutes. This sealing glass composition is a mixture of a glass powder and 1 to 50% (by weight) of one or more low expansion ceramic powders. The glass powder comprises a lead borate or lead zinc borate glass and the joint addition of Cu2O, Tl2O and F in a range of 6.3 to 20% (by weight) wherein the molar ratio of Cu to Tl to F is in the range between 0.8 Cu: 0.8 Tl: 0.8 F to 1.2 Cu: 1.2 Tl: 1.2 F. The glass in powder form is blended with one or more compatible low expansion ceramic powders including cordierite, zircon, willemite, lead titanate or modified tin oxide.
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申请公布号 |
US5281561(A) |
申请公布日期 |
1994.01.25 |
申请号 |
US19930015460 |
申请日期 |
1993.02.09 |
申请人 |
DUMESNIL, MAURICE E.;FINKELSTEIN, LEO |
发明人 |
DUMESNIL, MAURICE E.;FINKELSTEIN, LEO |
分类号 |
C03C3/074;C03C3/14;C03C8/24;(IPC1-7):C03C8/14;C03C3/072;C03C3/23 |
主分类号 |
C03C3/074 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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