发明名称 |
SEAL BONDING METHOD AND ITS BONDING STRUCTURE |
摘要 |
PURPOSE: To miniaturize an apparatus performing the leak-resistant bonding of two members in the ink container of a thermal ink jet printer without using a bonding member. CONSTITUTION: A first frame member 22A equipped with an inner upright pipe 28 having an opening 30 allowing an ink container and a printing head to communicate with each other formed thereto is formed and a second frame member 22B is formed by injection molding so as to surround the inner upright pipe 28 and cooled and contracted to realize the hermetic seal bonding resistance between both members. |
申请公布号 |
JPH0615690(A) |
申请公布日期 |
1994.01.25 |
申请号 |
JP19930084186 |
申请日期 |
1993.03.18 |
申请人 |
HEWLETT PACKARD CO <HP> |
发明人 |
JIEEMUSU JII SARUTAA;JIEEMUSU II KURAAKU;DEEIBITSUDO DABURIYUU SUWANSON;JIYOOJI EFU NASUWAASHII JIYUNIA |
分类号 |
B29C45/14;B29C45/16;B29L31/00;B41J2/175;(IPC1-7):B29C45/14 |
主分类号 |
B29C45/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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