发明名称 Molding mechanism
摘要 A molding mechanism including one pair of molding devices oppositely disposed in a body and each having a casing, and a number of pin elements arranged in matrix form in the casing, a board engaged in one side of the casing, and a bolt threaded through the casing for forcing the board toward the pin elements in order to fix the pin elements in place, whereby, a mold cavity is formed among the pin elements when the molding devices are moved toward an object disposed between the molding devices.
申请公布号 US5281117(A) 申请公布日期 1994.01.25
申请号 US19920896652 申请日期 1992.06.10
申请人 HONG, KUO-FUI 发明人 HONG, KUO-FUI
分类号 B28B7/02;B29C33/30;B44C3/04;(IPC1-7):B28B7/02 主分类号 B28B7/02
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