GOLD PLATING LIQUID AND GOLD PLATING METHOD,申请号JP19930006086-传众专利搜索

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发明名称	GOLD PLATING LIQUID AND GOLD PLATING METHOD
摘要
申请公布号	JPH0617258(A)	申请公布日期	1994.01.25
申请号	JP19930006086	申请日期	1993.01.18
申请人	HITACHI LTD;KIMURA EIICHI	发明人	YOKONO ATARU;OKA HITOSHI;USHIO JIRO;ANDO SETSUO;KIMURA EIICHI
分类号	C23C18/42;C25D3/48;(IPC1-7):C23C18/42	主分类号	C23C18/42
代理机构		代理人
主权项
地址

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