| 发明名称 |
Process for manufacturing a multi-layer lead frame having a ground plane and a power supply plane |
| 摘要 |
A process for manufacturing a multi-layer semiconductor lead frame comprising the step of adhering a lead frame strip to a metal power supply plane strip and a metal ground plane strip. |
| 申请公布号 |
US5281556(A) |
申请公布日期 |
1994.01.25 |
| 申请号 |
US19910701183 |
申请日期 |
1991.05.16 |
| 申请人 |
SHINKO ELECTRIC INDUSTRIES CO., LTD. |
发明人 |
SHIMIZU, MITSUHARU;TAKEDA, YOSHIKI |
| 分类号 |
H01L23/50;H01L21/48;H01L23/495;(IPC1-7):H01L21/58;H01L21/60 |
主分类号 |
H01L23/50 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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