| 摘要 |
PURPOSE:To absorb any slight thickness unevenness inherent in a wafer as well as to make highly accurate polishing work achievable by forming a wafer pressurizing part, directly holding this semiconductor wafer, with an elastic body film making up a fluid chamber. CONSTITUTION:A fluid being fed to a closed space 2 in the inner part of a polishing plate 1 from a fluid feeding nozzle 4 is fed to a fluid chamber 7 of a wafer pressure part 9 by way of a fluid supply hole 8, applying pressure to the whole surface of this wafer pressurizing part 9 uniformly. This wafer pressurizing part 9 is formed of an elastic body film 5 and a semiconductor wafer W is held on the underside, and in this case pressure is not imposed directly on this wafer W from the polishing plate 1 but internal pressure in the fluid chamber 7 of the wafer pressurizing part 9 is imposed to the wafer W which is pressed by an abrasive cloth under pressure. In this case, if there were thickness unevenness in this wafer W, the thickness unevenness is easily absorbable by the elastic body film 5. |
