发明名称 |
Surface acoustic wave device with improved junction bonding and package miniaturization |
摘要 |
A surface acoustic wave device in which a surface acoustic wave device element is arranged with interdigital electrodes on a piezoelectric substrate is packaged in a package provided in a metal pattern. Metal bumps are formed on a bonding pad section of the surface wave device element and the metal bumps are contact connected with the metal pattern of the package.
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申请公布号 |
US5281883(A) |
申请公布日期 |
1994.01.25 |
申请号 |
US19910787432 |
申请日期 |
1991.11.04 |
申请人 |
FUJITSU LIMITED |
发明人 |
IKATA, OSAMU;SATOH, YOSHIO;MIYASHITA, TSUTOMU;TAKAMATSU, MITSUO;MATSUDA, TAKASHI |
分类号 |
H03H9/25;H03H9/05;H03H9/10;(IPC1-7):H01L41/08 |
主分类号 |
H03H9/25 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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