| 摘要 |
PURPOSE:To test a junction between a metal wire and an electrode pad accurately when wire-bonding the electrode pad for wire bonding and a lead terminal, etc., with the thin metal wire on a semiconductor chip, etc. CONSTITUTION:A probe for conduction 9 is brought into contact with an electrode pad for wire bonding 5 or a part which is joined to the electrode pad and then voltage is applied between the probe 9 and a metal wire 7 which is joined to the electrode pad 5. |
