发明名称 SOLID STATE RELAY
摘要 <p>PURPOSE:To eliminate an insulating ceramic board and reduce the number of components to make an assembly work easy by a method wherein a pair of thyristor chips are attached to a thyristor attaching part provided on the tip of one of a pair of output lead terminal plates with insulating adhesive. CONSTITUTION:A pair of lateral thyristor chips Qa and Qb which are turned on and off by applying a light to their gate parts are connected in parallel and the light emitting part of a light emitting diode LED is optically coupled with the gate parts of both the thyristors Qa and Qb to compose a solid state relay. For that purpose, a thyristor attaching part 2 is provided on the tip of one (1d) of a pair of output lead terminal plates 1c and 1d and a light emitting diode attaching part 4 is provided on the tip of one (1a) of a pair of input lead terminal plates 1a and 1b. The pair of the thyristor chips Qa and Qb are bonded to the thyristor attaching part 2 with insulating adhesive made of polyimide resin and the thyristor chips Qa and Qb and the light emitting diode LED are molded with coupling synthetic resin 5.</p>
申请公布号 JPH0613646(A) 申请公布日期 1994.01.21
申请号 JP19920166591 申请日期 1992.06.25
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 FUKUMORI MINORU
分类号 H01L31/12;(IPC1-7):H01L31/12 主分类号 H01L31/12
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