| 摘要 |
PURPOSE:To make it possible to reduce the thickness of a package under LOC structure as far as possible. CONSTITUTION:There is provided a lead frame which has a semiconductor chip with a boding pad laid out on a peripheral part, a first inner lead 11 extending along one axis of the semiconductor chip approximately in its center as if dividing the semiconductor chip and second inner leads 12a and 12b installed at least one area out of the areas divided by the first inner lead. The lead frame is laid out on the top of the semiconductor chip. |
