| 摘要 |
PURPOSE:To align a die pad at a specified position and prevent a thin metal wire from exposure or the like by installing a plurality of projected parts at a specified position of a die pad on a lead frame or at a specified position of a die pad supporter. CONSTITUTION:A lead frame of a thin type package loads an IC chip 2 on its die pad 6. The pad of the IC chip 2 is electrically connected to a lead 7 with a thin metal wire 4. A die pad supporter 9 is clamped with a sealing mold and sealed with a sealing agent. During this sealing work, projected parts 8A to 8D restrict the degree of vertical freedom of the die pad 6 and enable the die pad 6 to be positioned as specified. This construction makes it possible to hold the die pad at a specified position even when the die pad is subjected to thermal expansion and prevent a partial exposure of the thin metal wire. |
