| 摘要 |
<p>PURPOSE:To suppress reduction in wiring area of a thin-film multilayer wiring layer, and to facilitate the emission of heat from a mounted semiconductor element without inducing complicated operations or cost increase. CONSTITUTION:A semiconductor element 18 is positioned on a die pad 16 disposed on the main surface of a thin-film multilayer wiring plate 9, and that element is also electrically connected to a connecting electrode pad 15 exposed to the outside on the main surface. A built-in heat transfer layer 12 led to the outside via a heat sink terminal 17 is arranged on the same outer surface of the wiring plate 9 where the element 18 is disposed, and the heat transfer layer is connected, in a heat transferring manner, to the die pad 16 on which the element 18 is mounted.</p> |
