| 摘要 |
<p>PURPOSE:To improve manufacturing efficiency by installing a data input part for changing driving data of a semiconductor manufacturing equipment, a data storing part, a data processing part and a display part in each semiconductor manufacturing equipment, and changing the driving data in each of the semiconductor manufacturing equipments. CONSTITUTION:A managing data processing part 120 and a data storing part 110 are contained in a managing computer equipment 100. Driving data of the data storing part 110 are constituted as hierarchical structure, and consist of an equipment name file 14, an unit name file 15, an operation item name file 16 and a setting file 17. Semiconductor manufacturing equipments n00 such as a die bonding equipment 200 and a wire bonding equipment 300 are arranged on a semiconductor manufacturing line. Semiconductor chips are subjected to manufacturing processes in order by the above equipments. There the change and the adjustment of driving data are easily possible in a short time, and the manufacturing efficiency and the working efficiency can be improved.</p> |
