| 摘要 |
<p>PURPOSE:To solve the difficulty of quality control of very small conductor pins in huge quantity resulting from a dramatic increase in package size and higher integration induced by a larger-sized and higher integrated electronic components, and what is more, tendency toward multiple chips and the difficulty caused by an increase in the number of mounting processes to a package and, moreover, solve the difficulty of a mounting technique which installs the package to a printed wiring board. CONSTITUTION:For a package loaded with electronic components and surface- mounted on a printed wiring board by way of an outside connection pin, there are provided a plurality of core-conductor-formed flexible pins which insulate the outside connection pins connected to the outer end of leads electrically connected to the electronic components, thereby forming this package.</p> |
