| 摘要 |
<p>PURPOSE:To house a thin lead frame and conduct conveyance and assembly, and to prevent the deformation of the lead frame at the time of operation. CONSTITUTION:A lead-frame housing carrier 1, in which a lead frame 3 formed by integrally molding a plurality of heat sinks 3a together with leads is housed and to which recessed section 1a, 1b are bored, and a cover plate 2, which has through-windows 2a, from which each heat sink 3a of the lead frame 3 housed in the carrier 1 and lead free-end sections 3b arranged around the heat sinks 3a are exposed, which detachably closes the cover of the carrier 1 and in which the lead frame 3 is received and held, are provided.</p> |
