| 摘要 |
PURPOSE:To always make it possible to hold and achieve the required functions by easily releasing heat generated from a semiconductor element placed and mounted on a thin film multilayer wiring layers. CONSTITUTION:This comprises a ceramic-based multilayer wiring plate 1 and a synthesized resin insulation layer-conductor pattern layer base-formed on one main surface of the ceramic multilayer wiring plate 1 incorporating a thin film multilayer wiring layer having a via holes 10, an insulation chip carrier 9 mounted and fixed on the thin film multilayer wiring layer 2, and a semiconductor element 3 mounted on the surface of an insulation chip carrier 9 and electrically connected to the thin film multilayer wiring layer 2. In addition, among the via holes 10 for connection, the via holes 10a located below the region, where the semiconductor element 3 is mounted, pass through the thin film multilayer wiring layer 2 and are extended at least to the surface of the ceramic-based multilayer wiring plate 1. |
