| 摘要 |
PURPOSE:To provide a method of bonding an electronic component, by which the electronic component can be bonded to a board by soldering without clinching the leads of the electronic component. CONSTITUTION:Solder 3 is supplied on a board 4, the board 4 is inverted, leads 8 of an electronic component 7 are inserted in lead insertion holes 5 in the board 4. The solder 3 is melted by a heat source 9 while the component 7 is held and the component 7 is bonded by soldering to the board. Accordingly, a space for clinching the leads 8 becomes unnecessary and the leads 8 enables high-density mounting on the board 4. Moreover, damage to the component 7 due to clinch is also never caused and the improvement of the quality and mounting density of the circuit board 4 mounted with the component 7 becomes possible. |
