| 摘要 |
PURPOSE: To provide a lead-over-chip type package device, which hardly generates package cracks, in a surface mount. CONSTITUTION: A lead-over-chip type lead frame covers the active surface of a semiconductor circuit 21. The rear surface of this semiconductor chip is covered with an amino-propyl-tri-ethoxy-silane film 21a. This amino-propyl-tri- ethoxy-silane film 21a increases the adhesive strength between the rear surface of the semiconductor circuit 21 and a molding compound 26 sealing the device into a capsule. Thus, the package cracks in the generation of layer releasing between the inactive surface of the chip and the molding compound can be decreased by a reflow during the soldering. |
