| 摘要 |
<p>PURPOSE:To transport semiconductor elements smoothly by preventing an adhesion of the semiconductor elements to a semiconductor element mounting face of a tray for keeping semiconductor elements, in transportation of the semiconductor elements from the tray. CONSTITUTION:Dotted projecting sections, dotted recessed sections, continuous or crossing grooves are formed on a semiconductor element mounting face of a tray for keeping semiconductor elements. By this, a surface roughness is artificially made large and an adhesion of semiconductor elements to the semiconductor element mounting face of the tray is prevented and thereby the transportation of the semiconductor elements from the tray is made smooth. To be more specific, one or more dotted projecting sections are formed on the semiconductor element mounting face 4 of the tray 12 and a rising area of the projecting sections is smaller than half the area of the semiconductor element mounting face.</p> |
