| 摘要 |
PURPOSE:To provide a mechanically strong film carrier, which can prevent the occurrence of a whisker and realize a higher-lead-count device with no fear of oxidation corrosion. CONSTITUTION:An inner lead 6 and an outer lead 7 are all coated with a plating layer 9 made of Ni or Ni-based alloy. Moreover, at least each place that is in contact with an electrode of a semiconductor device or a wiring board is coated again with a Pd or Pd-alloy plating layer 10 so that the inner lead 6 and the outer lead 7 are all coated with the plating layers 9 or 10. |
