GROUNDING STRUCTURE OF OPTICAL SEMICONDUCTOR DEVICE

摘要

PURPOSE:To achieve a secure grounding by a method wherein the terminal of the flange of an optical semiconductor module is inserted into a through-hole connected to the earth circuit of a mother printed board and soldered. CONSTITUTION:A circuit board 2 is fixed to a case bottom plate 1A and the head of a board earth terminal 7 is inserted into a through-hole connected to the earth pattern of the circuit board 2 and soldered and the bottom part of the board earth terminal 7 is inserted into the hole of the case bottom plate 1A and soldered. The head of the I/O terminal 9 of an optical semiconductor device is inserted into a through-hole connected to the required pattern of the circuit board 2 and soldered and made to pierce through the case bottom plate 1A with an insulating sealing. The flange 30 of an optical semiconductor module 100 is made to abut on the outer surface of a case side plate 1B and fixed to it with small screws 6. An earth lead 5-1 and an I/O lead 5-2 are drawn into the metal case 1 and connected to the required patterns of the circuit board 2. The head of an earth terminal 8 is soldered to the case bottom plate 1A of the metal case 1 to make the earth terminal 8 stand on the case bottom plate 1A.