| 摘要 |
<p>PURPOSE:To ensure long life of a blade and keep slight chipping of wafer by preventing uneven wearness of blade (phenomenon where the center area is recessed) due to uneven cooling of the dicing blade in a semiconductor waver dicing method and dicing apparatus. CONSTITUTION:A blade is cooled by supplying the cooling water of normal temperature to the periphery of the side surface of blade from the side surface nozzle 4 arranged in the proximity to both side surfaces of a blade and supplying the low temperature cooling water to a plurality of positions of the external circumferencial surface of the blade from the external circumferencial surface nozzle 15 which has a plurality of injection holes and arranged in the proximity of the external circumference of the blade.</p> |
