Semiconductor module coupled to pcb by face-down technology - has contact bumps of solder for connecting chip electrodes to circuit board electrodes, with wall piece not in contact with bumps

摘要

On the circuit board (2) several electrodes (8) are formed, corresp. to the chip electrodes (5). Several contact bumps (4) couple the chip electrodes to the circuit board ones on a 1:1 basis, with the bumps formed by solder metal. A wall element (2) of solder metal, not touching the contact bumps, connects the chip surface to that of the circuit board. Pref. the same metal is used for the wall element and the contact bumps. A first coupling layer (6) of the chip electrode material is provided between the chip (1) and the all element, while a second coupling layer (7) of the board electrode material is provided between the circuit board and the wall element. USE/ADVANTAGE - For face-down chip mounting in CCD camera etc., insensitive to thermal stress.