| 摘要 |
The present invention relates to a component module (70) comprised by at least one internal or external carrier substrate, at least one circuit (71) with at least thereto belonging surrounding components or components (72). The circuit (71) is directly mounted to the carrier substrate and the component module (70) comprises an enclosing device and furthermore is so formed that it can be directly mounted onto an external carrier substrate and or a printed board externally having the form and dimensions of a standard circuit and the enclosing device at least in one direction essentially encapsulating the major part component module. The invention furthermore relates to a transceiver module per se forming component module. |
