| 摘要 |
A method of etching, plating or applying solder to a substrate by the steps of: (A) forming a patterned image of a cured resist material upon the substrate, and (B) etching, plating or applying solder to portions of the substrate not protected by the resist, in which method the patterned resist image is formed from a liquid coating comprising: (i) water as a liquid carrier; (ii) a curable component, affording a film-forming material on curing, dispersed or emulsified in the water; and (iii) a flexibilising agent comprising an elastomeric polymer (or precursor therefor), dispersed or emulsified in the water. |
