Mounting semiconductor devices for cooling

摘要

There is disclosed a semiconductor device wherein a mounting substrate 15 including an insulating layer and a pattern electrode selectively provided on the insulating layer is mounted on a heat sink (6) having a major surface. A plurality of copper supports (2) each having a surface forming an angle of substantially not more than 90{ with the major surface of the heat sink (6) are provided on the mounting substrate 15 such that the respective surfaces are not opposed to each other, and each of the supports (2) supports a semiconductor body (1). The semiconductor bodies (1) are connected to the pattern electrode with wires (9), and a portion enclosing at least the wires (9) is filled with a silicone gel (11). This permits the semiconductor device of large capacity to be reduced in size and to have an improved durability. In other arrangements the supports 2 are of plate material in an L-shape or the angle between the support and the heat sink may be less than 90 DEG .