Computer interconnection assembly.

摘要

A high density computer interconnection assembly is provided by a plurality of flat packages slidably mounted along a rack in a frame in one given plane. The packages include edge connected processors and switch modules with associated power supply. One or two interconnection wiring circuit boards extend perpendicular to the one given plane and adjacent and along the edge of the edge connected modules to couple thereto whereby the interconnection circuit board couples said switch modules to said processor modules along one broad surface of said interconnection circuit board. Memory cards are coupled to the opposite broad surface of the interconnection circuit board. <IMAGE>