| 摘要 |
<p>A metal insert for at least partially embedding in a molded resin mass comprises a metal insert blank, with a substantial amount of nickel or nickel alloy granulations produced over a surface of it, the size of the granulations being at most 1.0 mu m. the metal insert blank is treated by a first electrolytic plating process such that a substantial quantity of copper nuclei are spread over the surface, and the copper nuclei are then grown up as the nickel or nickel alloy granulations by a second electrolytic plating process. The first electrolytic plating process is controlled such that the average thickness of the plating is from about 0.5 to about 1.0 mu m, and the second electrolytic plating process is controlled such that the average thickness of the plating is from about 0.5 to about 1.5 mu m.</p> |
